PCB Assembly. Fully realized.
Meritronics currently utilizes multiple production lines for manufacturing PCB's. Each line is specialized for unique customer requirements. With over 20 years of experience and investments on the newest equipment, Meritronics is able to provide fast turnaround times, cheaper costs, and higher quality products for clients.
DEK
Horizon
710
SMT Solder Paste Stencil Print
High-mixruns of small lots, deposits ultra-fine apertures on small component pads with many different paste types.
Features- -1.6 Cpk @ +/- 25um Accuracy and Repeatability
- -12 second cycle time
- -508x508mm PCB size
Fuji
Aimex
III
SMT Pick-and-Place
Picks up SMT components and places them accurately in a specified location on the board. Solder paste is applied to the boards before they are placed in the machine.
Features- Comp. placement: 0201 (0.25x0.125mm) to 102 mm x 25.4mm thick (Dyna head: custom multi-point nozzle and tray).
- H24 Head transparent flux dipping, height => 30 microns (fields in Part Data).
- Flying vision processing.
- 98N force (burst/thrust) for press fit connectors.
- 03015mm component: 35k CPH @ +/-25um and 40k CPH @ =/-38um accuracy.
- IPS Turned On: Checks for part's height
Heller
1809
MkIII
SMT Reflow Oven
Runs high mix / high volume up to 32 inches per minute. Precise temperature controls assuring process uniformity with identical profile performance in either air or nitrogen.
Features- The most efficient heat transfer.
- Wide process window allowing many different boards to be run on a single temperature profile.
Koh
Young
KY8030-2
3D Solder Paste Inspection
Measures solder paste deposition accurately to identify defects.
Features- Solves shadow problems by utilizing 2-way projection
- Provides accurate inspection data with real-time PCB warp compensation
- Realizes real-time process optimization through powerful SPC analytics
LPKF
Microline
2820P
PCB Board Laser Cutting
15 Watt UV laser cutting assembled PCBs, flexible PCBs and cover layers with complex electronic components without mechanical and thermal stress.
Features- Complex contours.
- No substrate brackets or cutting tools.
- Perforations and decays
MY300
dx
SMT Pick-and-Place equipment
Places SMT components from 01005 to BGA 140x73mm.
Features- 40,000 cph.
- 224 (8mm) feeders.
- 0201 chip repeatibility 3sigma = 30um, 1.8°
- Automatic feeder and component recognition.
- On-the-fly feeder loading.
- On-the-fly mount order optimization.
- Max board size (mm) 640 x 510.
MY300
dx
SMT Pick-and-Place equipment
Places SMT components from 01005 to BGA 140x73mm.
Features- 40,000 cph.
- 224 (8mm) feeders.
- 0201 chip repeatibility 3sigma = 30um, 1.8°
- Automatic feeder and component recognition.
- On-the-fly feeder loading.
- On-the-fly mount order optimization.
- Max board size (mm) 640 x 510.
Why Us
Let's Build Your Next Project
Or Call Us 1.408.969.0888